Dayadi, Irvin, et al. “Bond Shear Strength of Sungkai (Peronema Canescens Jack) Laminated Wood Based on Adhesive Type and Bonding Plane”. International Journal of Integrative Sciences, vol. 5, no. 9, Oct. 2026, pp. 1059-70, doi:10.55927/ijis.v5i9.66.